Case Studies

Real projects, real results. Explore how Sunmy has helped OEMs, engineering teams, and product developers across Europe and North America bring their designs to life — from complex CNC machined parts and precision turning to stamped components, castings, and injection-molded assemblies.

Each case study shows the challenge, the process, and the outcome — including how we handled material selection, tolerances, surface finishing, and quality verification with CMM and FAI.

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Category/Title

EMI/RF Shielding Can

Product

Custom Precision Stamped Tin-Plated SPCC EMI/RF Shielding Can (65x28x3mm)

Process

Precision Progressive Die Stamping, Precision Bending, Tin Plating

Customer’s Pain Point

During surface mount technology (SMT) reflow soldering, the 65mm long-span low-profile (3mm) shielding cans experienced thermal distortion, resulting in a coplanarity deviation exceeding 0.12mm. This lack of flatness caused localized solder joint failures (tombstoning/voids) and severe RF leakage in the high-frequency electronics module. Additionally, micro-tearing occurred at the stepped inner corners during the 90-degree bend, degrading the continuous Faraday cage effect.

Our Solution

Sunmy Hardware engineers conducted structural FEA to identify stress concentration zones. We redesigned the progressive die layout by integrating localized stress-relief notches and implementing a multi-stage forming sequence to minimize springback. A pre-tin-plated SPCC material with optimized grain orientation was selected to eliminate post-plating corner buildup. We maintained strict flatness controls using laser profilometry to guarantee coplanarity under 0.05mm across the entire 65mm span.

Result

Achieved 100% SMT yield rate with zero RF leakage detected. The co-planarity was consistently held below 0.03mm, and production scaled to 500,000 units/month with a stable Cpk > 1.66.