Product Overview
Designed for high-power electronic devices, this copper heatsink maximizes thermal conductivity. Copper is notoriously difficult to machine due to its ductility (“gumminess”), but it offers superior heat dissipation compared to aluminum. This product showcases our ability to handle challenging materials for functional applications.

Manufacturing Process Insight
CNC Milling
We use sharp, polished carbide tools and specific cutting strategies to prevent the soft copper from sticking to the cutter (built-up edge).

Fin Machining
The tall, thin cooling fins are machined with high aspect ratios. We carefully control feed rates to prevent the fins from bending during the cutting process.

Flatness Control
The base contact area is fly-cut to achieve extreme flatness and a mirror-like finish, ensuring maximum thermal transfer efficiency with the CPU or heat source.

Key Features & Benefits
Superior Thermal Conductivity
Copper (approx. 400 W/m·K) transfers heat almost twice as fast as Aluminum.

Complex Geometries
CNC machining allows for custom fin shapes and mounting holes that extrusion cannot achieve.

Surface Protection
Can be treated with anti-oxidation coating or nickel plating to prevent tarnishing over time.

Application
Ideal for lasers, 5G base stations, and high-performance computing (HPC) cooling.